Axiom Space and Resonac Corporation have signed a Memorandum of Understanding (MOU) to pioneer the research, development, and manufacturing of high-performance semiconductor materials in space. This strategic alliance aims to leverage the unique properties of the microgravity environment to advance next-generation chip technologies and accelerate the in-space manufacturing market. The collaboration will focus on utilizing low-Earth orbit (LEO) vacuum conditions to produce superior materials for critical semiconductor applications and advanced chip packaging.
A key advantage of microgravity is the virtual absence of convection and sedimentation. This pristine environment presents a significant opportunity to grow defect-free semiconductor bulk crystals, high-purity resins, and flawless 2D materials, a process often hindered by gravity on Earth. The partnership plans to utilize the International Space Station, Axiom Space’s existing orbital platforms, and the future Axiom Station to progress from initial proof-of-concept experiments to commercially viable scale manufacturing.
A parallel objective of the MOU is to extend Resonac’s current work on radiation-resistant materials. The company is developing specialized molding compounds designed to reduce soft errors in semiconductor devices. These errors occur when cosmic rays interfere with transistors, causing data corruption. Resonac is actively testing simple devices fabricated with various molding material compositions in the internal and external environment of the International Space Station to solve this challenge.
This alliance between Axiom Space and Resonac is poised to shape the future of space-enabled manufacturing. By combining Axiom’s space infrastructure with Resonac’s cutting-edge materials solutions, the collaboration lays the groundwork for scalable orbital production. The initiative is a definitive step toward fostering industrial growth and driving innovation that will benefit semiconductor technology for industries both on Earth and in space.
